Trxcom manufactures physical-layer transmission components from silicon PHY interfaces to optical backplanes. By integrating discrete magnetics, EMI-shielded cages, and optical transceivers, we guarantee verified signal integrity (SI) and electromagnetic compliance (EMC) for telecom, data center, and industrial networks.
Internal integration of isolation transformers, common-mode chokes, high-voltage caps, and bi-color LEDs. Saves over 50% PCB real estate while delivering superior ESD and EMI shielding.
Industry-standard 1x1 MagJack covering 100Base-TX to 10GBase-T with integrated lightning surge protection and bi-color LED options.
Engineered for automated Pick-and-Place SMT lines with high-temperature LCP housing resistant up to 260°C peak reflow profiles.
180-degree straight vertical mating architecture, perfect for top-panel testing interfaces and dense enclosure backplanes.
Ultra-slim physical profile designed specifically for 1U low-clearance chassis, ultra-dense server blades, and thin-client terminals.
Hybrid 2-in-1 connector merging gigabit magnetics with single or dual USB 2.0/3.0 Type-A ports to cut panel cutout costs by 60%.
Single-row horizontal ganged modules with dedicated magnetic cores per channel, delivering superior inter-port crosstalk suppression.
Two-tier vertical stacked architecture optimizing 1U faceplate port density for 24-port and 48-port enterprise switches and data centers.
High-reliability discrete Ethernet & telecom transformers providing precise impedance matching, galvanic isolation, and bidirectional noise filtering compliant with IEEE 802.3 and ITU-T G.703.
Engineered for 10/100/1000Base-T and 2.5G/5G/10GBase-T discrete PHY applications with ultra-low insertion loss and robust return loss margins.
Houses two independent Ethernet transformer channels in a compact SMD footprint, optimizing PCB layout and reducing SMT placement time.
Four-channel integrated gigabit/10G isolation module delivering maximum routing density for high-port-count switch boards and backplanes.
Proprietary high-current magnetic cores designed to resist DC saturation under 720mA - 1200mA bias currents, eliminating packet drops under heavy power draw.
Designed for primary rate telecom interfaces (T1 1.544Mbps, E1 2.048Mbps, CEPT & ISDN PRI). Features optimized turns ratios (1:1, 1:2, 1:2.42CT) and low interwinding capacitance to deliver crisp pulse waveforms matching ITU-T G.703 templates.
Hot-pluggable optical-to-electrical transceivers built to SFF Multi-Source Agreements (MSA). Widely compatible with major switch OEMs, featuring DDM/DOM real-time digital monitoring.
Standard Gigabit hot-pluggable transceivers offering multimode (SX), singlemode (LX/EX/ZX), BIDI single-fiber, and copper RJ45 variations.
10G Ethernet workhorse module available in SR, LR, ER, ZR, CWDM/DWDM dense wavelength multiplexing, and 10GBase-T copper formats.
Engineered for 25GbE networks and 5G eCPRI mobile front-haul, leveraging single-lane 25Gbps NRZ modulation for cost-efficient server uplinks.
4-lane parallel optical transceiver supporting 40G aggregations, high-performance computing (HPC), and SAN switch fabrics.
The standard for modern 100G cloud data center backbones, spanning SR4, LR4, CWDM4, PSM4, and ZR4 long-distance optical links.
8 electrical lanes utilizing 50Gbps PAM4 signaling. Backwards compatible with legacy QSFP form factors for high-density AI compute clusters.
Built for hyperscale generative AI training clusters. Features native thermal fins, delivering up to 800Gbps (8x100G PAM4) per interface.
High-frequency mechanical cages and internal SMT/press-fit electrical connectors featuring 360° EMI shielding, customizable light pipes, and riding heat sink compatibility.
Designed for 1.25Gbps SFP modules with resilient copper-alloy spring fingers and elastomeric gaskets to prevent RF leakage at the bezel.
Optimized ground-return paths engineered to suppress 10GHz harmonics, guaranteeing robust return loss and minimal inter-port EMI.
Precision-stamped connector pins delivering 100Ω differential impedance held tightly to ±5Ω tolerances, passing 25Gbps eye-diagram tests.
Rugged mechanical assembly engineered for 40G transceivers and active/passive direct attach cables (AOC/DAC) with > 250 cycle latch retention.
The standard for 100G core routing line-cards, featuring low-dielectric molding to dampen high-frequency resonant modes and crosstalk.
Dual-row 76-pin SMT/press-fit connector with aerodynamic airflow channels, handling the rigorous thermal and RF demands of 400G PAM4 modules.
Customized for 800Gbps and terabit switch front panels. Integrates optimized air intake ducting and low-inductance ground pins for pristine PAM4 signal fidelity.
From industrial edge computing to enterprise distribution layers, Trxcom switches are powered by our own proprietary magnetics and optical interfaces, guaranteeing 24/7 non-blocking wire-speed throughput.
5-port to 24-port Fast Ethernet and Gigabit plug-and-play desktop/rackmount switches. Fanless silent design with IEEE 802.3az Energy Efficient Ethernet.
Full IEEE 802.3af/at/bt compliance delivering up to 90W per port with intelligent PoE budget scheduling, short-circuit protection, and 250m long-reach extension.
Engineered for harsh industrial operating environments: -40°C to +85°C operating range, 6KV surge protection, dual redundant DC power inputs, and DIN-rail clipping.
Full network management stack supporting 802.1Q VLAN isolation, QoS priority queuing, IGMP snooping, and ultra-fast ERPS ring recovery (< 20ms).
In high-speed networking, component-level compliance does not guarantee system-level pass rates. Trxcom breaks supplier silos by co-designing and validating the entire physical-layer chain, de-risking your engineering timeline and eliminating EMI/SI design finger-pointing.
From the silicon PHY interface through magnetic windings to the connector contact pins, we provide end-to-end Eye-Diagram and S-Parameter characterization.
Optical transceiver shielding seamlessly mates with our SFP/QSFP cage elastomeric spring fingers, providing total RF containment to pass FCC Part 15 and CISPR 32 Class B.
Direct drop-in replacements for Pulse, TE Connectivity, Amphenol, Molex, and Wurth without redesigning footprints. Tailored pinouts and 6KV high-surge custom windings delivered in days.
Direct answers to common engineering questions regarding layout rules, standards compliance, and cross-referencing.
Yes. Trxcom manufactures exact pin-to-pin, footprint-compatible drop-in replacements for standard industrial part numbers. Our FAEs provide complete side-by-side electrical comparison datasheets and test reports to verify OCL, insertion loss, return loss, and crosstalk margins before sample validation.
Our SMT MagJacks feature high-temperature UL 94V-0 liquid crystal polymer (LCP) bodies suitable for lead-free reflow profiles peaking at 260°C. We provide ready-to-import Altium, OrCAD, and KiCad footprint libraries (.lib / .step) with optimized keep-out and chassis-ground separation zones.
Trxcom transceivers undergo host-switch interoperability testing across Cisco, Arista, Juniper, Dell, and Huawei switches. We program custom EEPROM/MSA vendor-identification coding upon request to ensure seamless hot-plug recognition without CLI port-security errors.
